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Move allows advanced semiconductor packaging for the age of AI.
September 29, 2023
By: DAVID SAVASTANO
Editor, Ink World Magazine
SCHOTT is taking steps to support the integrated circuit (IC) industry in advancing the pace of Moore’s Law with new materials. This development is needed for more powerful computing intended for applications such as artificial intelligence (AI). As uncompromised, high-quality glass substrates are crucial for enabling advanced packaging in the upcoming decade, SCHOTT is proactively setting the course to enable the industry to innovate even further. The future of chip packaging starts wi...
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